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Shenzhen Shinelink Technology Ltd
Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer
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BGA PCB Assembly Service

Shenzhen Shinelink Technology Ltd
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BGA PCB Assembly Service

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Brand Name : Shinelink

Model Number : SL0925S04

Certification : UL, Rohs

Place of Origin : China

MOQ : Negotiable

Price : Negotiable

Payment Terms : L/C, T/T, Western Union, MoneyGram

Supply Ability : 5000 Piece/Pieces per Day

Delivery Time : 7-12 days

Packaging Details : ESD Bag

PCB Assembly : SMT, BGA

Board thickness : 1.6mm

Surface finishing : HASL

Min. line spacing : 4/4mil(0.1/0.1mm)

Min. line width : 0.075mm/0.075mm(3mil/3mil)

Min. hole size : 0.20mm,4mil

Pcb assembly method : SMT

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Customized PCB Assembly Service , BGA PCB Assembly with X Ray Test

Before assembling, SHINELINK will take time to make sure the PCBs and all of the components are in a good condition according to the functionality. Everything is ok, then the whole production will go smooth and fast, this will save much time,cause we know it’s crucial to you.

After assembling,we can test them according to your requirements. We’re flexible, only if we have the conditions which can meet you, we will do the best, meanwhile, test reports are available.
We handle every process of the production to ensure you get everything you want, even more. You can rest assured when you choose to use us.

Files Requested For PCB Assembly Quotation

---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required



Shinelink kinds PCBA product

BGA PCB Assembly Service

94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly

SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils


THT(Wave soldering) process (RoHs Compliant) Capabilities up to:

1.Single side wave soldering
2.SMT & THT mixture process

BGA PCB Assembly Service

PCB Assembly Capabilities

Turnkey PCBA PCB+components sourcing+assembly+package
Assembly details SMT and Thru-hole, ISO lines
Lead Time Prototype: 15 work days. Mass order: 20~25 work days
Testing on products Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need PCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel Size Min size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder Type Water Soluble Solder Paste, RoHS lead free
Components details Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component package Cut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing


PCBA Picture


BGA PCB Assembly Service

FAQ:

1. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.


2. What’s the merits of O-leading's rIgid-flex PCB?
SHINELINK’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.

3. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.


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